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  • SNOWMAN 13.8W/mk Thermal Pad Non-Conductive Multi-Size Silicone Mat for CPU Graphics Card Water Insulation Materials Elements
SNOWMAN 13.8W/mk Thermal Pad Non-Conductive Multi-Size Silicone Mat for CPU Graphics Card Water Insulation Materials Elements
SNOWMAN 13.8W/mk Thermal Pad Non-Conductive Multi-Size Silicone Mat for CPU Graphics Card Water Insulation Materials Elements - Image 2
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SNOWMAN 13.8W/mk Thermal Pad Non-Conductive Multi-Size Silicone Mat for CPU Graphics Card Water Insulation Materials Elements

Category Brand: ,

LKR3,450.00

or up to 4 X LKR862.50 with Payzy Payzy

1 in stock (can be backordered)

Credit Card Installment Plans Available for orders above LKR 10,000

3/6/12 months
Installments

3/6/12 months
Installments

3/6/12 months
Installments

3/6/12 months
Installments

Description

SNOWMAN 13.8W/mk Thermal Pad Non-Conductive Multi-Size Silicone Mat for CPU Graphics Card Water Insulation Materials Elements

Key Specifications

  • Brand: Snowman

  • Material: High-performance thermally conductive silicone

  • Thermal Conductivity: 13.8 W/m·K

  • Thickness: 0.5 mm (ideal for tight gaps and thin clearance areas)

  • Dimensions: 85 mm × 45 mm (larger rectangular piece)

  • Color: Gray

  • Hardness: 30–50 Shore C / SC (soft, pliable, and easy to compress)

  • Breakdown Voltage: 10 kV/mm (provides safe electrical insulation)

  • Corrosive: No

    Key Features & Benefits

    • High Efficiency: The 13.8 W/m·K rating ensures rapid heat transfer, effectively lowering the operating temperatures of high-demand chips to prevent thermal throttling.

    • Safety First: The material is non-conductive, non-toxic, and flame-retardant. Because it does not conduct electricity, it will not short out nearby surface-mounted components if it overflows or slips.

    • Plasticity & Compression: The soft silicone naturally compresses (30–50 Shore C hardness) to tightly conform to uneven surfaces, textures, and microscopic air gaps.

    • Easy Application: Features a peel-and-stick design. It is completely dry and structurally cohesive, making it much easier to handle than paste.

    • Trimmable: The 85×45mm rectangular pad can be easily cut with standard scissors or a hobby knife to fit smaller, customized components.

      Common Applications

      This ultra-thin 0.5mm thermal pad is commonly utilized in the following areas:

      • Graphics Cards (GPUs): Replacing aged factory pads over VRAM chips and VRM (voltage regulator modules) power phases.

      • Storage Components: Placed under M.2 NVMe SSD heatsinks to control high heat generation during continuous read/write cycles.

      • Laptops & Consoles: Used on internal copper cooling assemblies for gaming laptops and consoles like the PS5.

      • Other Electronics: Applied to RAM sticks, motherboard chipsets, LED drivers, and small server components.

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